Thermal Management

Thermal Leveller and Thermal Straps

Know more About Product

Momentive Performance Materials Inc. offers a unique heat sink product that contains a TPG* core (>1500 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance. The TPG-EX composite heat sink provides:

Typical Physical Properties

  • Parallelism: 0.0005" (0.01mm)
  • Flatness: 0.001"/1" (1μm/1mm)
  • Surface Finish: Ra 16 μin (0.4 μm)
  • Plating: Ni 160-250 μin (4-6 μm) /
  • Au 40-80 μin (1-2 μm)

Potential Applications

  • Power electronic package RF microwave package Laser diode
  • High power LED

Packaging standards(MIL-STD-883H) qualified

  • Hermeticity
  • Thermal cycling
  • Shock vibration resistances

Thermal Management

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