Know more About Product
Momentive Performance Materials Inc. offers a unique heat sink product that contains a TPG* core (>1500 W/m-K) and a coefficient of thermal expansion (CTE) matched enclosure for superior thermal management performance. The TPG-EX composite heat sink provides:
Typical Physical Properties
- Parallelism: 0.0005" (0.01mm)
- Flatness: 0.001"/1" (1μm/1mm)
- Surface Finish: Ra 16 μin (0.4 μm)
- Plating: Ni 160-250 μin (4-6 μm) /
- Au 40-80 μin (1-2 μm)
Potential Applications
- Power electronic package RF microwave package Laser diode
- High power LED
Packaging standards(MIL-STD-883H) qualified
- Hermeticity
- Thermal cycling
- Shock vibration resistances
